Abstract: An advanced Intel 3 FinFET technology is presented that has been optimized to provide 10% logic scaling, a full node of performance improvement and improved reliability compared to Intel 4.

Synopsys (SNPS) announced on June 17 the launch of its new Multiphysics Fusion platform, combining its AI-powered chip design tools with Ansys analysis technology to help customers develop advanced AI ...

Li Auto Inc has unveiled a new high-end vehicle cockpit platform powered by Qualcomm’s latest Snapdragon 8797 Elite automotive chipset, as the Chinese battery electric vehicle (BEV) manufacturer steps ...

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