Abstract: In this work, the change in the dielectric constant and thickness of the interfacial region around a nanoparticle in a composite is studied as a function of change in the composition of the ...

Abstract: Fan-out package with localized silicon interconnection using embedded bridge dies (FO-EB) have been developed for high performance computing (HPC). The typical FO-EB package is integrated ...

Google has released A2UI v0.9, a framework-agnostic standard for AI agents to declare user interface intent across multiple ...

An Indonesian researcher has developed a modified asphalt formula using natural Buton asphalt and recycled used engine oil, ...

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The big picture: Most people never think about what's inside a circuit board, but a little-known resin is quickly becoming a major concern for the tech industry. High-purity polyphenylene ether resin ...