UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...

KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...

Microchip Technology recently announced the availability of its new 3,3 kV HV‑D3 mSiC Power Modules, designed to simplify and accelerate the adoption of solid-state transformers ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

A new class of medium-voltage power modules has been introduced to support next-generation energy infrastructure, offering ...

SHENZHEN, GUANGDONG, CHINA, June 22, 2026 /EINPresswire.com/ -- In a rapidly evolving semiconductor landscape, GNS ...

Partnership unites UWBG semiconductor & advanced packaging materials for HVDC grid technology to unlock massive power ...

GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...

GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) ...

Nexperia and Semikron Danfoss have signed an MoU to explore a strategic collaboration on SiC-based power modules for automotive traction inverter applications. The collaboration aims to combine ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

The recently reported cyberattack against Tata Electronics is shaping up to be one of the most consequential attacks exposing ...