Ring-oscillator process monitors give production test teams a fast on-die frequency measurement for identifying CMOS process variation and sorting dies at wafer level. A process monitor is a dedicated ...

Imec and semiconductor equipment supplier EV Group (EVG) have demonstrated a wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch, marking a step ...

Abstract: In this study, we present a microstrip-based microwave patch antenna sensor (MPAS) that can be embedded into a wafer to measure plasma on the wafer without bulky coaxial architectures.

Abstract: In the periodic scheduling problems of a dual-arm wafer-residency-time-constrained (W-R-T-C) cluster tool (CT) with multivariety wafers, it is important to balance workload at each step.