Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
P620 includes six independent, isolated channels that can simulate platinum RTDs and resistances Highland Technology announces the latest release in its line of standalone test and measurement modules ...
After testing modernized Leopard 1 with new C3105 turret for Ukraine, more such modules were ordered for vehicles, first 5 of which will arrive only in June 2027 Ukraine is already testing modernized ...
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