The new module design combines Oxford PV’s tandem perovskite-silicon and Fraunhofer ISE’s Matrix Shingle technologies. Image: Fraunhofer ISE/Jacob Forster. Perovskite PV specialist Oxford PV and ...
Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
Abstract: In order to drive an actual electromagnetic launch load, multiple inductive pulsed power modules need to operate in coordination and keep symmetrical. Stacking is one of the main solutions ...
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