IEEE

Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures

Abstract: Heat dissipation is a critical issue in a backside power delivery network (BSPDN) chip package because heat from the powered transistors must travel through the signal interconnects (that ...
UAE Moments on MSN

Java plums aren't for everyone—who may want to limit them

Java Plums Aren't for Everyone—Who May Want to Limit Them ...
Supercar Blondie on MSN

California woman shares the 'rookie mistakes' you need to avoid if you've just bought an EV

Here’s what you should and shouldn’t do ...

The Easiest Way To Identify Where Dangerous Rip Currents Are On The Beach

The beach is where we go to relax and recharge, but it can also be dangerous if you're not careful. Here's how to identify ...