Section 1. Purpose. The United States continues to lead the world in Artificial Intelligence (AI) because of the enormous talent and innovation of our AI industry, and because we refuse to stifle this ...

Shubham Kumar from IIT Delhi zone secured AIR 1 in JEE Advanced 2026 Arohi Deshpande emerged as the female topper in JEE Advanced 2026 IIT Roorkee announced the JEE Advanced 2026 results and topper ...

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory ...

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With the launch of Gemini 3 last November, Google introduced “Gemini Agent” as an “experimental feature that handles multi-step tasks.” It’s due for a big upgrade, according to a new report and ...

Git isn't hard to learn, and when you combine Git and GitHub, you've just made the learning process significantly easier. This two-hour Git and GitHub video tutorial shows you how to get started with ...

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

Forward-looking: Modern data storage has a short lifespan. Hard drives fail, SSDs wear out, and even magnetic tape needs periodic rewriting to avoid degradation. Now, an ambitious technology is aiming ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...