Thermocomp OFM76XXP and OFM76EXP compounds deliver enhanced thermal stability, impact strength, and flame retardancy for ...
Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
Abstract: The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar ...
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